Sony has reportedly just patented a new sealed liquid cooling system that will likely replace liquid metal in the upcoming PlayStation 6. The new cooling system is designed to reduce the risk of leaks, improve thermal efficiency for extended gaming sessions, and create stable temperatures that allow the PS6 to be placed in both vertical and horizontal orientations without issues.
The patent describes a sealed liquid vaporization system that regulates the circulation of the liquid with heat pipes. These pipes will have tapered and extended sections that are designed to ensure the console can safely be placed in either orientation without risk of overheating or creating liquid metal issues.
Patent Suggests PS6 Will Have An Upgraded Cooling System
Early PS5 models had issues when placed in the vertical position for long periods of time, resulting in uneven buildup of liquid metal and less contact between the heatsink and the chip, and Sony implemented hardware revisions in the PS5 Pro and PlayStation Slim CFI-2116, but the new sealed liquid system should solve this problem once and for all.
As reported by Spazio Games, the patent details the new cooling system's structure, which utilizes heat pipes to...
